Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D (2)

Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D (1)

Panasonic Modular Chip Mounter NPM-W2 NM-EJM7D

The Panasonic NPM-W2 amplifies the exceptional capabilities of the original NPM-W platform with a 10% throughput boost and 25% higher placement accuracy. It also integrates cutting-edge innovations such as our incomparable Multi Recognition Camera. Combined, these advanced features extend the component range down to 03015 mm microchips while preserving full handling capability for large components up to 120 x 90 mm, heights up to 40 mm, and long connectors up to nearly 6 inches (150 mm).

Innovative Multi Recognition Camera Technology

Featuring a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single unified system: 2D alignment, component thickness inspection, and 3D coplanarity measurement.

Key Features

Higher productivity and quality through seamless integration of printing, placement, and inspection processes.
Designed for larger circuit boards and PCBs up to 750 x 550 mm, with a component handling range up to L150 x W25 x T30 mm.
Maximized area productivity and line efficiency via dual-lane placement.
Equipped with quick-change feeder carts and nozzle banks for rapid line changeovers.
Features a lightweight 16-nozzle head delivering up to 77,000 CPH with enhanced placement accuracy to 25 µm (Cpk ≥ 1.0).

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Core Performance Parameters & Technical Specifications

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Additional Key Features

Dual-Lane Modes:
- Independent Mode: Two different PCBs with different programs can run simultaneously.
- Alternate Mode: Optimizes throughput for a single PCB type.
- Mixed Mode: Flexible combination for complex production.
Recognition System:
- Multi-recognition camera system (2D + 3D).
- Performs thickness, coplanarity, and presence checks.
Optional Functions:
- Dispensing Unit: ±75µm accuracy, 0.16 sec/dot.
- 3D SPI/AOI (In-line or off-line).
- Auto Board Support Pins.

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Parameter Category	Specification
Placement Speed	Maximum: 77,000 CPH (theoretical) Typical (IPC9850): ~59,200 CPH (for 1608 components)
Placement Accuracy	Standard: ±30µm (Cpk ≥ 1.0) High-Precision Mode: ±25µm
Board Size	Single-Lane Mode: 50 × 50mm ~ 750 × 550mm (L × W) Dual Independent-Lane Mode: 50 × 50mm ~ 750 × 260mm per lane
Component Range	Minimum: 03015 (0.3 × 0.15mm) microchips Maximum: 150 × 25 × 30mm (L × W × H) large connectors / odd-form parts
Head Configuration	Independent for each lane; options include 16-nozzle, 12-nozzle, or 8-nozzle heads.
Feeder Capacity	Maximum: 120 stations (8mm tape pitch, using Twin Feeder Configuration) Tape Widths Supported: 4, 8, 12, 16, 24, 32, 44, 56mm
Power Requirements	3-Phase AC, 200/220/380/400/420/480V, 2.8kVA
Air Requirements	0.5 MPa, 200 L/min (A.N.R.)
Machine Dimensions (W x D x H)	Approx. 1280 × 2332 × 1444 mm (excluding options)
Machine Weight	Approx. 2470 kg (main unit, varies with configuration)