FUJI SMT Machine NXTR

Specification Data

Category / Feature Specifications & Details
Machine Type High-End Modular Placement Machine (Smart Factory Platform)
Max. Placement Speed Up to 60,000 CPH per module (depending on head type)
Placement Accuracy Standard: ±25 µm (±0.025 mm) / High Accuracy Mode available
Component Range From 0201 (metric) micro-chips up to large/odd-form components
PCB Size (Single Lane / 1R) Min: 48 x 48 mm  |  Max: 750 x 610 mm
PCB Size (Dual Lane / 2R) Max: 370 x 610 mm (Dual conveyor parallel production)
Automation & Supply Smart Loader system for automated part supply and changeover
Design Concept 3 Zeros: Zero placement defects, Zero machine operators, Zero machine stops
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FUJI Smart Factory Platform & NXTR SMT Mounter

To minimize the gap between production planning and operational reality while maximizing efficiency, optimal production schedules must seamlessly manage material flows in real-world manufacturing. The FUJI Smart Factory Platform NXTR is an advanced, next-generation mounter platform designed to integrate effortlessly with the Nexim integrated production system, driving end-to-end automation and productivity across diverse production environments.

High-End Electronic Component Mounter - NXTR

The NXTR is a flagship, high-end placement machine engineered to pursue supreme placement quality and throughput. By expanding supported panel sizes, enhancing part-handling capabilities, and optimizing real-time data processing, it builds upon the renowned Fuji design concepts:

  • Compact Footprint & High Area Productivity: Maximizes output per square meter on the factory floor.
  • Modular & Simple Operation: Streamlines single-side operation and makes line configuration flexible.
  • Automated Feeder Exchange: Features a newly developed automatic feeder exchange system that eliminates manual changeover burdens and supply delays.

With the NXTR, Fuji is actively paving the way toward the future of fully autonomous, intelligent Smart Factories.

Core Development Concept: 3 Zeros

The NXTR is engineered around the revolutionary "3 Zeros" development concept, aiming to eliminate production losses, reduce operator intervention, and achieve flawless, zero-defect placement quality in high-speed SMT manufacturing lines.

FUJI NXTR Development Concept 3 Zeros and Placement Technology

Figure: FUJI NXTR Advanced Component Placement & 3 Zeros Concept

1. Zero Placement Defects

Stable, high-quality component placement is consistently maintained using newly-developed sensing technology. By continuously monitoring and evaluating the real-time conditions of electronic parts and circuit boards, the system dynamically feeds corrections back into the machine to ensure absolute placement precision.

FUJI NXTR Zero Placement Defects Advanced Sensing Technology

Figure: Advanced Sensing Technology for Zero Placement Defects

2. Zero Machine Operators

The newly-developed Smart Loader completely automates part supply and handles production changeovers seamlessly in accordance with the pre-established production schedule. This advanced automation effectively prevents short stops caused by component supply errors, as well as delays and operational mistakes typically introduced during manual supply work.

FUJI NXTR Working Head and Smart Loader Automation

Figure: NXTR Working Head and Smart Loader Automation System

3. Zero Machine Stops

The NXTR successfully continues the comprehensive modularity concept pioneered by the NXT series.

Working heads and other critical units can be quickly exchanged without requiring any tools, making it entirely possible to perform maintenance offline and minimize line downtime.

Furthermore, predictive maintenance is fully enabled through advanced self-diagnosis capabilities, preventing sudden, unexpected machine stops from disrupting your core production plans.

FUJI NXTR - Physical Dimensions & Specifications

Specification Item Details & Data
Machine Dimensions (1R Module) 795 × 1,740 × 1,480 mm (L × W × H)
Machine Dimensions (2R Module) 1,590 × 1,740 × 1,480 mm (L × W × H)
Machine Weight Approx. 610 kg (1R Base) / Approx. 730–800 kg (2R Base, varies by configuration)
PCB Size Capacity (1R Single) Min: 48 × 48 mm  |  Max: 750 × 610 mm
PCB Size Capacity (2R Dual) Min: 48 × 48 mm  |  Max: 370 × 610 mm
Power Supply 3-phase AC 200 to 230 V ±10 V (50/60 Hz)
Air Supply & Consumption 0.4 MPa  |  Approx. 50–100 L/min (ANR) depending on module type

FUJI NXTR - Working Heads Specifications & Lineup

Head Type Nozzles / Spindles Component Range Key Features & Applications
RH4 Head 4 Spindles (Rotary) 0201 (metric) up to large components High-speed rotary head designed for versatile production and multi-size component handling.
RH8 Head 8 Spindles (Rotary) 0201 (metric) up to medium size Optimized for high-density, high-speed placement of standard chip components.
H12HS Head 12 Spindles (High Speed) Micro-chips (0201 / 0402 etc.) Ultra-high-speed multi-spindle head for maximum throughput on standard chip parts.
H04 / H04SF Head 4 Spindles (Multi-purpose) Large ICs, Connectors, Odd-form Designed for large components, odd-form parts, and heavy-duty placement tasks with high precision.
H08 / H08M Head 8 Spindles Medium ICs and general parts Offers an excellent balance between placement speed and component size flexibility.

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