Advanced PCB Cleaning Solutions For Precision SMT Lines

Dry ultrasonic cleaning machines use high-speed aerodynamic ultrasonic airflow and 3-in-1 ion wind to remove dust without water or chemical detergents. Unlike wet cleaning, it achieves true zero consumables, leaves no liquid residue, and protects complex 3D PCB surfaces from secondary contamination.

While dust cleaners focus on removing physical micro-particles and debris, inline plasma cleaners are designed for molecular-level surface activation, organic contamination removal, and improving surface energy before wire bonding, underfill, or precision coating processes.

Our cleaning machines are equipped with intelligent ion-generating modules (ion wind systems) that neutralize static charges on the PCB surface simultaneously during the cleaning process, preventing dust re-adsorption and protecting sensitive semiconductor components.

Yes. All our cleaning systems (including dry ultrasonic models like A-500/A-510/A-520 and plasma cleaners) support standard SMEMA interfaces, adjustable track heights, and optional MES functionality for smart factory tracking.

Maintenance is minimal. For dry ultrasonic cleaners, it mainly involves regular filter checks and air-source pressure monitoring (5–8 kgf/cm²). Plasma systems require periodic nozzle or electrode inspection depending on operating hours.