Panasonic Modular Chip Mounter NPM-D3 NM-EJM6D

Feature

1. High-Speed Performance

Placement Speed: Up to 92,000 CPH (components per hour) in optimal configurations
Dual-Lane Operation: Supports simultaneous production on two lanes, doubling throughput
Zero Board Exchange Time: In dual-lane mode, board exchange occurs without stopping production

2. Precision Placement Capability

Placement Accuracy: ±30μm to ±40μm (depending on component type and mode)
Advanced Vision System: Dual laser recognition and high-resolution cameras for component verification
Component Range: Handles components from 01005/0201 metric chips to large connectors (up to L6×W6×T3 mm)

Add to Inquiry Cart

More Features

1. Modular and Flexible Design

Dual-Head Configuration: Supports multiple placement head types (12-nozzle, 8-nozzle, 2-nozzle heads)
Feeder Compatibility: Works with various feeder types including tape, tray, and stick feeders
Scalable Architecture: Modular design allows for easy expansion and integration into production lines

2. Advanced Automation Features

Intelligent Feeder Management: Automatic feeder recognition and setup
Real-Time Calibration: On-the-fly adjustment for optimal placement accuracy
User-Friendly Software: Intuitive interface for programming and production monitoring

3. Production Efficiency

High-Mix Capability: Handles multiple product types on the same line with quick changeovers
Low Maintenance Design: Reduced downtime with easy access to consumable parts
Compact Footprint: Space-efficient design despite high performance

4. Application Versatility

Suitable for various industries including consumer electronics, automotive electronics, telecommunications, and medical devices, supporting components from microchips to large odd-form devices.

The NPM-D3 is particularly valued for its combination of speed, precision, and flexibility in high-volume SMT manufacturing environments.

Core Performance Parameters

Additional Key Features

Dual-Lane Modes:
- Independent Mode: Two different PCBs with different programs can run simultaneously.
- Alternate Mode: Optimizes throughput for a single PCB type.
- Mixed Mode: Flexible combination for complex production.
Recognition System:
- Multi-recognition camera system (2D + 3D).
- Performs thickness, coplanarity, and presence checks.
Optional Functions:
- Dispensing Unit: ±75μm accuracy, 0.16 sec/dot.
- 3D SPI/AOI (In-line or off-line).
- Auto Board Support Pins.

Parameter Category	Specification
Placement Speed	Up to 92,000 CPH (components per hour)
Placement Accuracy	±30μm to ±40μm
Component Range	01005/0201 chips to L6×W6×T3mm large components
Dual-Lane Operation	Simultaneous production on two lanes
Modular Design	Scalable with multiple head configurations
Vision System	Dual laser + high-resolution cameras
Feeder Compatibility	Tape, tray, and stick feeders
Zero Board Exchange	Continuous production in dual-lane mode