3D Solder Paste Inspection System JUTZE Mirage

Mirage (Standard Single-Track SPI)

• Measurement accuracy: Height 1 μm, flatness 10–15 μm (adjustable)

• PCB range: 50 × 70 mm to 510 × 460 mm, board thickness 0.6–6 mm

• Warpage compensation: ±3 mm, with built-in automatic PCB warpage compensation

• Camera: 4MP/12MP telecentric lens, bidirectional 3D digital projection

• Inspection speed: 330 ms/field of view (2D+3D simultaneous inspection)

• Dimensions: W1080 × D1300 × H1850 mm, net weight 777 kg

2. Storm-SPIS (Economy-Class SPIS/SPID)

• SPIS: Single-track standard version; SPID: Dual-track model, compatible with dual-track SMT production lines

• Light source: RGB ring white light + multi-channel LEDs, 3D four-beam projection

• 12MP high-spec configuration, suitable for precision FPCs and Mini LED small boards

II. Core Advantages of the Equipment

1. Bidirectional 3D grating projection eliminates shadows and ensures stable measurement of fine solder joints

2. Built-in SPC data analysis; one-click export of solder paste yield and trend reports

3. Software compatible with data integration from multiple SMT machine brands; real-time transmission of defects back to the production line

4. Classic green-and-white color scheme; side-mounted monitor on the control panel for a compact, space-saving layout

III. Comparison with Similar Models (JUTZE vs. KOHYOUNG KY8030-2)

• JUTZE: High cost-effectiveness and low after-sales costs; commonly used for small-to-medium batches and consumer electronics

• KOHYOUNG: Higher maximum precision; standard equipment for high-end PCB and automotive board manufacturers