Lead-Free Dual Wave Soldering Machine Medium-sized

Key Advantages:

1. Versatile Process Compatibility

  • Universal Application: Fully compatible with both lead-free and leaded soldering processes to meet diverse production requirements.

2. Precision & Resource Efficiency

  • Automated Accuracy: Equipped with high-precision stepper motors and rodless cylinders for automated fluxing and solder positioning.

  • Cost-Effective Design: Anti-oxidation solder nozzle technology significantly reduces material waste and lowers operational costs.

3. Superior Thermal Performance

  • Closed-Loop Control: Real-time feedback ensures precise synchronization of PCB preheating and soldering durations.

  • Uniform Heating: Optimized micro-hot-air circulation with independent zone control delivers superior thermal stability and rapid, consistent heating across the board.

4. Simplified Maintenance & Automation

  • Automated Maintenance: Features an automatic titanium finger cleaning system, reducing the need for manual intervention.

  • User-Friendly Design: Motorized solder pot assembly facilitates easy access and maintenance, effectively increasing production uptime and reducing labor costs.

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Technical Parameter
FK-S1825M
FK-S2830M
Configuration
Touch Screen + PLC
Touch Screen + PLC
Preheating Method
2-Stage Hot Air Heating
3-Stage Hot Air Heating
Wave Peak Number
Dual Wave Peak
Dual Wave Peak
Solder Pot Lift
Electric In/Out
Electric In/Out
Claw Cleaning Method
Automatic Titanium Claw Cleaning
Automatic Titanium Claw Cleaning
Flux Spraying Drive
Stepper Motor
Stepper Motor
Max Board Width
Max 250 mm
Max 300 mm
Solder Pot Capacity
200 KG
280 KG
Preheating Length
800 mm (2-Stage)
1500 mm (3-Stage)
Wave Peak Height
12 mm
12 mm
Over Board Component Pin Length
10 mm
10 mm
PCB Transport Height
750 ± 20 mm
750 ± 20 mm
Total Power
11 KW
15 KW
Running Power
3.5 - 5 KW
5 - 7 KW
Machine Frame Size
1800 × 1200 × 1500 mm
2800 × 1200 × 1500 mm
External Dimensions
2600 × 1200 × 1600 mm
3600 × 1200 × 1600 mm
PCB Transport Speed
0 - 1.8 m/min
0 - 1.8 m/min
Preheating Zone Temperature
Room Temp - 180°C
Room Temp - 180°C
Heating Method
Hot Air
Hot Air
Cooling Method
Axial Fan Cooling
Axial Fan Cooling
Solder Pot Temperature
Room Temp - 300°C
Room Temp - 300°C
Transport Direction
Left -> Right
Left -> Right
Temperature Control Method
PID + SSR
PID + SSR
Flux Capacity
Max 5.2 L
Max 5.2 L
Spraying System
Stepper Motor + ST-6
Stepper Motor + ST-6
Power Supply
3-Phase 5-Wire 380V 50Hz
3-Phase 5-Wire 380V 50Hz
Air Source
4-7 KG/CM2 (12.5 L/Min)
4-7 KG/CM2 (12.5 L/Min)
Weight
800 KG
Approx 1200 KG
PCB Top Max Height Limit
100 mm
100 mm
PCB Bottom Pin Length Limit
10 mm
10 mm
PCB Transport Direction Standard
Left -> Right
Left -> Right

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