MIRTEC MV-9 3D AOI Machine

Highlight：

25-megapixel Top Camera

4 Way Multi-Frequency Moire Technology

QHD Projection

8 Phase Color Lightning System

10-megapixel Side-Viewer

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MV-9 3D AOI Introduction

MV-9 Series is

is a premium full 3D inline vision inspector with 25 Mega Pixel high resolution camera, 4 direction QHD Moire projection, 10-megapixel side cameras and 8 phase color lighting system to have capability to inspect up to 0201(mm)chip.

With the Best Technology,Precise 3D

QHD resolution moiré projection unit measures the components in EWSN 4 directions in 3 dimensions to obtain the 3D image for accurate and fast defect detection.

4 Way Multi-Frequency Moire Technology

Obtain 3D image without blind spots using 4 3D projections
Various component height inspection with the combination of high and low frequency moire pattern
Linkage with the main camera to apply Full 3D inspection to detect
various defects flawlessly

QHD Projection

Fine height change detection is possible due to miniaturizing of

fringe pattern pitch

Chip height measurement repeatability improved
Chip height measurement error compared to SXGA reduced
Fillet ratio measurement accuracy/repeatability improveddetect

various defects flawlessly

The World’s First High Resolution 25 Mega Pixel Camera

We are proud to have applied the next-generation vision system with the 25 Megapixel high-resolution camera for more precise and stable inspection and high-speed CoaXPress transmission method to allow 4 times more data transmission and 40% increased process speed

World’s Only 25 Mega Pixel Loaded
CoaXpress high performance vision system applied
Large FOV to increase inspection speed
7.7µm super precise camera to inspect 03015 chip
Processing speed increased by 40% compared to Camera Link

8 Phase Lighting System for Precise Inspection

Through 8 different lights combination a clear noise free image is obtained to give various types of precise defect detection.

Color change extraction following angle of reflection
Appropriate for Chip / IC lead lift and solder defect detection
Precise Solder Joint inspection

Linear Motor System

0.5µm resolution applied to control

precise position

Data feedback possible for mounter

position adjustment

Highest GR&R, CP/CPK reliability guaranteed

10-Megapixel Side Viewer

4 cameras in EWSN applied
The only J-lead inspection solution
Convenient naked eye verification after inspection

Intellisys® System

When a defect occurs in the line,understanding in advance as well as remote control is possible while reducing costs from defective products

MV-9 3D AOI Series Specifications

Model	MV-9	MV-9U	MV-9DL
Max PCB Size Range (mm)	50 x 50 - 510 x 460	60 x 60 - 660 x 610	50 x 50 - 330 x 250
OMNI-VISION® 3D/2D Inspection Technology
3D Inspection Technology	Digital Multi Frequency Quad Moiré Technology
2D Inspection Technology	ISIS® Vision System
Height Accuracy	±3μm
Maximum Component Height	25 Mega Pixel	Option 1 (7.7μm)	4mm
Maximum Component Height	15 Mega Pixel	Option 1 (15μm) / Option 2 (10μm)	5mm / 4mm
Inspection Item	2D Inspection	Missing, Misalignment, Polarity, Tomb Stone, Manhattan, Bridge, Turn Over, Wrong Component, Scratch, Solder Ball, Foreign Body, Shift, Tilt, BGA Ball, Wave Solder (Pin Hole), Etc
Inspection Item	3D Inspection	Missing, Component, Height, Position, Lifted Package, Lifted Lead, Solder Fillet, Excessive Solder, Insufficient Solder, Open Solder, Double Chip, Manhattan, Tomb Stone, Tilt, Dimension, Foreign, Etc
ISIS® Vision System (FOV Size)
25 Mega Pixel Camera	CXP	Pixel Resolution: 7.7μm / 39.42mm x 39.42mm
25 Mega Pixel Camera	CL	Pixel Resolution: 7.7μm / 38.93mm x 38.93mm
15 Mega Pixel Camera	Option 1: 15μm / 58.56mm x 58.56mm \| Option 2: 10μm / 39.04mm x 39.04mm
15 Mega Pixel Camera	System Specification
Lens Configuration	Precision Telecentric Compound Lens
Lighting System	Eight Phase Color Lighting
Side Viewer® Camera System	10 Mega Pixel Digital Color Side Cameras (4ea)
PCB Top/Bottom Clearance	Top: 45mm / Bottom: 25mm (Option: 50.8mm)
Maximum PCB Warpage	±3μm
Barcode System (1D/2D)	Keyence 1D / Leuze (1D-Scan) / Data Logic (1D) / Cognex (1D/2D) / Micro Scan (1D/2D)
Built-in SPC / Repair / OLTT	Statistical Process Control Software / Repair Software / Off-Line Teaching Tool Software
Minimum Measurement Size	25 Mega Pixel	0201 Chip (mm) / 0.3 Pitch (mm)
Minimum Measurement Size	15 Mega Pixel	0603 Chip (mm) / 0201 Chip (inch) / 0.4 Pitch (mm) / 03015 (mm) / 0.3 Pitch (mm)
Robot Positioning System	X/Y Axis	Precision Linear Drive Motor System
	Resolution	0.5μm
	Repeatability	±2μm
Power Requirements	MV-9 (Single Lane) / MV-9DL (Dual Lane)	Single Phase(s) 200-240V 50-60Hz, 1.1 KW / 1.5 KW(Dual)

Our Services

We go beyond delivering powerful machinery to provide a complete partnership built on expertise and unwavering support. Our service ecosystem is designed to ensure maximum uptime, productivity, and return on your investment.

1.Pre-Sales Technical Support

1.1 Technical consultation & line layout planning 1.2 Demo machine testing with customer materials 1.3 Pre-sales training for technical team

2. Delivery & Commissioning

2.1 Professional installation & calibration 2.2 Parameter optimization for specific PCBs 2.3 Trial production validation 2.4 Operator training (SOP, maintenance, troubleshooting) 2.5 Acceptance test with performance verification

3. After-Sales Support

3.1 1-year standard warranty (extendable) 3.2 7×24 hotline, 4-hour emergency response 3.3Scheduled preventive maintenance (quarterly/half-yearly) 3.4 Genuine spare parts supply 3.5 Remote diagnosis & software updates

4. Value-Added Services (Optional)

4.1 Performance upgrades (software/hardware) 4.2 Production efficiency optimization analysis 4.3 Advanced technical training programs 4.4 Extended warranty (2-3 years) 4.5 Equipment relocation service

Our Promise

We are dedicated to being a true partner in your success, providing the tools, knowledge, and continuous support necessary to keep your projects moving forward efficiently and profitably.